Procedure: All Fusions

VIA DBM Plus is a demineralized bone matrix putty containing cortical bone chips and indicated for use in the extremities, posterolateral spine, and pelvis as a bone void filler or for treatment of osseous defects. VIA DBM Plus combines demineralized cortical chips (1-4mm) with the proven formulation of VIA DBM Putty, eliminating the need for cumbersome intra-operative mixing. Utilizing demineralized instead of mineralized cortical chips ensures that the additional graft material does not diminish osteoinductivity. VIA DBM Plus has excellent handling properties and a 510(k) designation from the FDA.